This conversation examines chiplet-driven data center architectures and ai
factories. Mike Han of Silicon Box, chief revenue officer, joins theCUBE
Research hosts John Furrier and Dave Vellante to discuss the company's origin,
technical approach and manufacturing strategy. Han outlines the focus on chiplet
architectures and panel-scale packaging and explains how these capabilities
enable high-density heterogeneous integration; they describe manufacturing in
Singapore and planned expansion in Italy and explain how these innovations
support artificial intelligence applications in data centers, automotive,
robotics and broader semiconductor markets. Key takeaways include that
chiplet-based designs and panel-scale packaging reduce interconnect costs and
enable substantially higher density, offering a 4–6x productive-area advantage
versus traditional wafer-scale approaches. Han reports strong cross-market
demand beyond AI, including mobile and electric vehicle, EV platforms. theCUBE
analysts John Furrier and Dave Vellante underscore supply constraints and the
talent mix required such as electrical engineers, physicists and materials
scientists, and they highlight the strategic impact of the Italy factory
expansion for manufacturing capacity and supply chain resilience.
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In this interview from theCUBE + NYSE Wired: AI Factories - Data Centers of the Future, Mike Han, chief revenue officer of Silicon Box, joins theCUBE's John Furrier to discuss how chiplet architecture is powering the next wave of AI infrastructure. Han traces Silicon Box's founding story — built in 2021 by three semiconductor veterans who recognized the limits of Moore's Law and bet on chiplets as the architecture the industry would eventually require. He explains how the company's large panel-scale manufacturing, operating at four to six times the output of ...Read more
