Mike Han, SILICON BOX
This conversation examines chiplet-driven data center architectures and ai factories. Mike Han of Silicon Box, chief revenue officer, joins theCUBE Research hosts John Furrier and Dave Vellante to discuss the company's origin, technical approach and manufacturing strategy. Han outlines the focus on chiplet architectures and panel-scale packaging and explains how these capabilities enable high-density heterogeneous integration; they describe manufacturing in Singapore and planned expansion in Italy and explain how these innovations support artificial intelligence applications in data centers, automotive, robotics and broader semiconductor markets. Key takeaways include that chiplet-based designs and panel-scale packaging reduce interconnect costs and enable substantially higher density, offering a 4–6x productive-area advantage versus traditional wafer-scale approaches. Han reports strong cross-market demand beyond AI, including mobile and electric vehicle, EV platforms. theCUBE analysts John Furrier and Dave Vellante underscore supply constraints and the talent mix required such as electrical engineers, physicists and materials scientists, and they highlight the strategic impact of the Italy factory expansion for manufacturing capacity and supply chain resilience.