Storage Beyond the GPU: The CPU at the Center of Agentic AI Infrastructure
This theCUBE Power Panel at AMD’s Advancing AI event examines positioning the central processing unit, CPU, at the center of agentic artificial intelligence, AI, infrastructure. Participants include John Mao of VAST Data, global head of business development; Penny Tseng of AMD, product marketing and market development; Ben Lee of Supermicro, director of solution management; and Dave Vellante of SiliconANGLE Media, Inc., co-founder and co‑CEO. The discussion draws on expertise in data platforms, silicon design and systems engineering to examine how EPYC processors, Supermicro H14 platforms and VAST’s all‑flash architecture combine to feed accelerators reduce bottlenecks and support agentic AI workloads across non‑volatile memory express, NVMe, peripheral component interconnect express, PCIe and evolving network fabrics. Mao, Tseng and Lee emphasize a return to CPU-centric orchestration for data pipelines. They highlight the role of PCIe Gen6 and higher memory bandwidth such as double data rate 5, DDR5 and DDR5‑8000 in preventing network and input/output bottlenecks. They advocate aggressive software-driven data reduction to mitigate NAND supply pressures. Mao and Tseng stress that focusing on performance-per-watt and end-to-end total cost of ownership, TCO, is essential for enterprises evaluating on‑prem co-location or hybrid AI deployments.